Read e-book online Investigations on Microstructure and Mechanical Properties PDF

By Qingke Zhang

ISBN-10: 3662488213

ISBN-13: 9783662488218

ISBN-10: 366248823X

ISBN-13: 9783662488232

This thesis offers a chain of mechanical attempt tools and comprehensively investigates the deformation and harm habit of Cu/Pb-free solder joints below diverse loading stipulations. The fracture habit of Pb-free joint interfaces caused by way of tension, deformation of solder and substrate are proven, the shear fracture energy of the Cu6Sn5 IMC is measured experimentally for the 1st time, and the dynamic harm technique and microstructure evolution habit of Pb-free solder joints are printed intuitively. The thesis places ahead the argument that the neighborhood cumulative harm is the foremost reason for failure in solder joints. The learn effects give you the experimental and theoretical foundation for bettering the reliability of solder joints.

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Additional resources for Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

Example text

Zhu FL, Zhang HH, Guan RF, Liu S. 5. Microelectron Eng. 2007;84:144–50. 46. Mavoori H, Chin J, Vayman S, Moran B, Keer L, Fine M. Creep, stress relaxation, and plastic deformation in Sn–Ag and Sn–Zn eutectic solders. J Electron Mater. 1997;26:783–90. 47. Ochoa F, Willlams JJ, Chawla N. %Ag solder. J Electron Mater. 2003;32:1414–20. 48. Schoeller H, Bansal S, Knobloch A, Shaddock D, Cho J. Microstructure evolution and the constitutive relations of high-temperature solders. J Electron Mater. 2009;38:802–9.

Deng X, Sidhu RS, Johnson P, Chawla N. 5Ag solder/Cu joints. Metall Mater Trans A. 2005;36A:55–64. 88. Kima KS, Huh SH, Suganuma K. Effects of intermetallic compounds on properties of Sn– Ag–Cu lead-free soldered joints. J Alloys Compd. 2003;352:226–36. 89. Yoon JW, Kim SW, Jung SB. 7Cu/Ni BGA solder joints during isothermal long-term aging. J Alloys Compd. 2005;391:82–9. 90. Choi WK, Kim JH, Jeong SW, Lee HM. 5Ag-X (X = Cu, In, Ni) solder joint. J Mater Res. 2002;17:43–51. 91. Kim SW, Yoon JW, Jung SB.

The images in Fig. 9a, c, e are actually cross sections of these Cu6Sn5 layers, thus they consist well with the 3D images. To analyze the stress applied on the Cu6Sn5 grains and their fracture behavior, it is necessary to give a quantitative description on their shape. According to Figs. 10, the protrudent Cu6Sn5 grains are centrosymmetric grains with the contour lines of their cross sections similar to the parabola; thus in this study, they are approximately described by a revolution body of the parabola y ¼ ax2 , in which y is the length of the Cu6Sn5 grain, x is the radius and a is a shape parameter.

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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces by Qingke Zhang

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